Microprocessor controller integrated XY2-100 standard
Apertures: 7-14 mm.
Accuracy: < 10% of spot size.
USB interface.
Fiber laser compatibility.
Laser
Systems WarpScan scan heads provide the positioning of laser beams
under computer control for materials processing and for scientific and
medical applications. It is ideally suited for the manufacturing
industry for:
Marking
Deep Engraving
Drilling
Welding
Electronic Component Trimming
Micro-Lithography
LS
scan heads are integrated with optics and scan lenses to meet
customers’ specific requirements. Electronics required for a direct
interface with computer systems are included with the scan head to
facilitate complete system integration. These compact heads are
mechanically and electrical compatible for easy integration into
existing marking machines. The scan head optics can be customized for
various laser wave lengths and power levels.
Laser Marking
Head is an electro optic device which focuses and directs a high energy
laser beam under computer control for material processing. The focused
beam is used to mark a material for identification or to machine the
material for cutting, drilling or welding. The energy from the focused
beam is intense so that the material is heated quickly at the focal
point without affecting the macro properties of the material. Typical
applications are marking parts for identification, drilling of very
small holes in circuit boards and other materials. Materials ranging
from diamonds to plastics can be processed at high speed.
